Description

AMD Ryzen 5 7500F Tray Processor:

Product Description:

The AMD Ryzen 5 7500F is a desktop processor with 6 cores, launched in July 2023, at an MSRP of $179. It is part of the Ryzen 5 lineup, using the Zen 4 (Raphael) architecture with Socket AM5. Thanks to AMD Simultaneous Multithreading (SMT) the core-count is effectively doubled, to 12 threads. Ryzen 5 7500F has 32 MB of L3 cache and operates at 3.7 GHz by default, but can boost up to 5 GHz, depending on the workload. AMD is building the Ryzen 5 7500F on a 5 nm production process using 6,570 million transistors. The silicon die of the chip is not fabricated at AMD, but at the foundry of TSMC. You may freely adjust the unlocked multiplier on Ryzen 5 7500F, which simplifies overclocking greatly, as you can easily dial in any overclocking frequency.

With a TDP of 65 W, the Ryzen 5 7500F consumes typical power levels for a modern PC. AMD’s processor supports DDR5 memory with a dual-channel interface. The highest officially supported memory speed is 5200 MT/s, but with overclocking (and the right memory modules) you can go even higher. ECC memory is supported, too, which is an important capability for mission-critical systems, to avoid data corruption. For communication with other components in the system, Ryzen 5 7500F uses a PCI-Express Gen 5 connection. This processor does not have integrated graphics, you will need a separate graphics card. Inside the box you will not only find the processor, but also a Wraith Stealth cooler.

Product Specifications:

Specification	Details
Platform	Desktop
Market Segment	Enthusiast Desktop
Product Family	AMD Ryzen™ Processors
Product Line	AMD Ryzen™ 5 Desktop Processors
AMD PRO Technologies	No
Consumer Use	Yes
Regional Availability	Global
Former Codename	“Raphael AM5”
Architecture	Zen 4
# of CPU Cores	6
Multithreading (SMT)	Yes
# of Threads	12
Max Boost Clock	Up to 5.0 GHz
Base Clock	3.7 GHz
L1 Cache	384 KB
L2 Cache	6 MB
L3 Cache	32 MB
Default TDP	65 W
Processor Technology for CPU Cores	TSMC 5nm FinFET
Processor Technology for I/O Die	TSMC 6nm FinFET
CPU Compute Die (CCD) Size	71 mm²
I/O Die (IOD) Size	122 mm²
Package Die Count	2
Unlocked for Overclocking	Yes
AMD EXPO™ Memory Overclocking Tech.	Yes
Precision Boost Overdrive	Yes
Curve Optimizer Voltage Offsets	Yes
AMD Ryzen™ Master Support	Yes
CPU Socket	AM5
Supporting Chipsets	A620, X670E, X670, B650E, B650
CPU Boost Technology	Precision Boost 2
Instruction Set	x86-64
Supported Extensions	AES, AMD-V, AVX, AVX2, AVX512, FMA3, SHA, SSE, SSE2, SSE3, SSE4.1, SSE4.2, SSE4A, SSSE3, x86-64
Thermal Solution (PIB)	AMD Wraith Stealth
Thermal Solution (MPK)	AMD Wraith Stealth
Max Operating Temperature (Tjmax)	95°C
Launch Date	7/22/2023
OS Support	Windows 11/10, RHEL x86 64-bit, Ubuntu x86 64-bit

Connectivity

Specification	Details
USB Type-C Support	Yes
Native USB 3.2 Gen 2 (10Gbps) Ports	4
Native USB 3.2 Gen 1 (5Gbps) Ports	0
Native USB 2.0 (480Mbps) Ports	1
Native SATA Ports	Yes
PCI Express® Version	PCIe 5.0
Native PCIe® Lanes (Total/Usable)	28 / 24
Additional Usable PCIe Lanes	X670E (12x Gen4), X670 (12x Gen4), B650E (8x Gen4), B650 (8x Gen4), A620 (4x Gen3)
NVMe Support	Boot, RAID0, RAID1, RAID10

Memory Specifications

Specification	Details
System Memory Type	DDR5
Memory Channels	2
Max Memory	128 GB
System Memory Subtype	UDIMM
Max Memory Speed	DDR5-5200 (2x1R, 2x2R) / DDR5-3600 (4x1R, 4x2R)
ECC Support	Yes (Requires mobo support)

Graphics Capabilities

Specification	Details
Integrated Graphics	No
Graphics Model	Discrete Graphics Card Required

 

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